M. A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, R. B. R. van Silfhout, X. J. Fan, J. H. J. Janssen. Virtual qualification of moisture induced failures of advanced packages. Microelectronics Reliability, 47(2-3):273-279, 2007. [doi]
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