Analysis of Cu/low-k bond pad delamination by using a novel failure index - researchr publication authors

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M. A. J. van Gils, O. van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken. Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectronics Reliability, 47(2-3):179-186, 2007. [doi]

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