Analysis of Cu/low-k bond pad delamination by using a novel failure index

M. A. J. van Gils, O. van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken. Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectronics Reliability, 47(2-3):179-186, 2007. [doi]

Abstract

Abstract is missing.