Sandeep Kumar Goel. Shaping the Future of Multi-Die Stacking: Overcoming Challenges through Collaboration and Standards. In IEEE European Test Symposium, ETS 2026, Chania, Greece, May 25-29, 2026. pages 1, IEEE, 2026. [doi]
@inproceedings{Goel26,
title = {Shaping the Future of Multi-Die Stacking: Overcoming Challenges through Collaboration and Standards},
author = {Sandeep Kumar Goel},
year = {2026},
doi = {10.1109/ETS69887.2026.11591770},
url = {https://doi.org/10.1109/ETS69887.2026.11591770},
researchr = {https://researchr.org/publication/Goel26},
cites = {0},
citedby = {0},
pages = {1},
booktitle = {IEEE European Test Symposium, ETS 2026, Chania, Greece, May 25-29, 2026},
publisher = {IEEE},
isbn = {979-8-3195-1763-0},
}