V. Gonda, K. M. B. Jansen, L. J. Ernst, J. den Toonder, G. Q. Zhang. Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques. Microelectronics Reliability, 47(2-3):248-251, 2007. [doi]
@article{GondaJETZ07,
title = {Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques},
author = {V. Gonda and K. M. B. Jansen and L. J. Ernst and J. den Toonder and G. Q. Zhang},
year = {2007},
doi = {10.1016/j.microrel.2006.09.033},
url = {http://dx.doi.org/10.1016/j.microrel.2006.09.033},
tags = {testing},
researchr = {https://researchr.org/publication/GondaJETZ07},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {47},
number = {2-3},
pages = {248-251},
}