Neela Gopi, Jeffrey Draper. Techniques for assigning inter-tier signals to bondpoints in a face-to-face bonded 3DIC. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-6, IEEE, 2013. [doi]
@inproceedings{GopiD13-1, title = {Techniques for assigning inter-tier signals to bondpoints in a face-to-face bonded 3DIC}, author = {Neela Gopi and Jeffrey Draper}, year = {2013}, doi = {10.1109/3DIC.2013.6702384}, url = {http://dx.doi.org/10.1109/3DIC.2013.6702384}, researchr = {https://researchr.org/publication/GopiD13-1}, cites = {0}, citedby = {0}, pages = {1-6}, booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013}, publisher = {IEEE}, }