Photonic Interconnects for Interposer-based 2.5D/3D Integrated Systems on a Chip - researchr publication authors

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Paolo Grani, Roberto Proietti, Venkatesh Akella, S. J. Ben Yoo. Photonic Interconnects for Interposer-based 2.5D/3D Integrated Systems on a Chip. In Bruce Jacob, editor, Proceedings of the Second International Symposium on Memory Systems, MEMSYS 2016, Alexandria, VA, USA, October 3-6, 2016. pages 377-386, ACM, 2016. [doi]

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