Philipp Grubitzsch, Iris Braun, Heiko Fichtl, Thomas Springer, Tenshi Hara, Alexander Schill. ML-SLA: Multi-Level Service Level Agreements for Highly Flexible IoT Services. In IEEE International Congress on Internet of Things, ICIOT 2017, Honolulu, HI, USA, June 25-30, 2017. pages 113-120, IEEE, 2017. [doi]
@inproceedings{GrubitzschBFSHS17,
title = {ML-SLA: Multi-Level Service Level Agreements for Highly Flexible IoT Services},
author = {Philipp Grubitzsch and Iris Braun and Heiko Fichtl and Thomas Springer and Tenshi Hara and Alexander Schill},
year = {2017},
doi = {10.1109/IEEE.ICIOT.2017.20},
url = {https://doi.org/10.1109/IEEE.ICIOT.2017.20},
researchr = {https://researchr.org/publication/GrubitzschBFSHS17},
cites = {0},
citedby = {0},
pages = {113-120},
booktitle = {IEEE International Congress on Internet of Things, ICIOT 2017, Honolulu, HI, USA, June 25-30, 2017},
publisher = {IEEE},
isbn = {978-1-5386-2011-3},
}