Jian Gu, Jian Lin, Yongping Lei, Hanguang Fu. Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling. Microelectronics Reliability, 80:29-36, 2018. [doi]
@article{GuLLF18,
title = {Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling},
author = {Jian Gu and Jian Lin and Yongping Lei and Hanguang Fu},
year = {2018},
doi = {10.1016/j.microrel.2017.10.014},
url = {https://doi.org/10.1016/j.microrel.2017.10.014},
researchr = {https://researchr.org/publication/GuLLF18},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {80},
pages = {29-36},
}