Jian Gu, Jian Lin, Yongping Lei, Hanguang Fu. Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling. Microelectronics Reliability, 80:29-36, 2018. [doi]
@article{GuLLF18, title = {Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling}, author = {Jian Gu and Jian Lin and Yongping Lei and Hanguang Fu}, year = {2018}, doi = {10.1016/j.microrel.2017.10.014}, url = {https://doi.org/10.1016/j.microrel.2017.10.014}, researchr = {https://researchr.org/publication/GuLLF18}, cites = {0}, citedby = {0}, journal = {Microelectronics Reliability}, volume = {80}, pages = {29-36}, }