Yong Guan, Qinghua Zeng, Jing Chen, Shenglin Ma, Yufeng Jin. Fabrication and characterization of fine pitch TSV integration with self-aligned backside insulation layer opening. In 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016, Sendai, Japan, April 17-20, 2016. pages 91-94, IEEE, 2016. [doi]
Abstract is missing.