Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability

A. Guédon-Gracia, E. Woirgard, C. Zardini. Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability. Microelectronics Reliability, 45(9-11):1652-1657, 2005. [doi]

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