Matthias Gulbins, Fabian Hopsch, Peter Schneider, Bernd Straube, Wolfgang Vermeiren. Developing digital test sequences for through-silicon vias within 3D structures. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-6, IEEE, 2010. [doi]
Abstract is missing.