P. Guo, Z. Y. Chang, Emile Noothout, Hendrik J. Vos, Johannes G. Bosch, N. de Jong, Martin D. Verweij, Michiel A. P. Pertijs. A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink. In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023. pages 1-2, IEEE, 2023. [doi]
@inproceedings{GuoCNVBJVP23-0,
title = {A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink},
author = {P. Guo and Z. Y. Chang and Emile Noothout and Hendrik J. Vos and Johannes G. Bosch and N. de Jong and Martin D. Verweij and Michiel A. P. Pertijs},
year = {2023},
doi = {10.23919/VLSITechnologyandCir57934.2023.10185159},
url = {https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185159},
researchr = {https://researchr.org/publication/GuoCNVBJVP23-0},
cites = {0},
citedby = {0},
pages = {1-2},
booktitle = {2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023},
publisher = {IEEE},
isbn = {978-4-86348-806-9},
}