6.5 A 0.5° - Resolution Hybrid Dual-Band Ultrasound Imaging SoC for UAV Applications

Jiaqi Guo, Junwei Feng, Silin Chen, Liuhao Wu, Chne Wuen Tsai, Yingna Huang, Bochi Lin, Jerald Yoo. 6.5 A 0.5° - Resolution Hybrid Dual-Band Ultrasound Imaging SoC for UAV Applications. In IEEE International Solid-State Circuits Conference, ISSCC 2024, San Francisco, CA, USA, February 18-22, 2024. pages 108-110, IEEE, 2024. [doi]

@inproceedings{GuoFCWTHLY24,
  title = {6.5 A 0.5° - Resolution Hybrid Dual-Band Ultrasound Imaging SoC for UAV Applications},
  author = {Jiaqi Guo and Junwei Feng and Silin Chen and Liuhao Wu and Chne Wuen Tsai and Yingna Huang and Bochi Lin and Jerald Yoo},
  year = {2024},
  doi = {10.1109/ISSCC49657.2024.10454469},
  url = {https://doi.org/10.1109/ISSCC49657.2024.10454469},
  researchr = {https://researchr.org/publication/GuoFCWTHLY24},
  cites = {0},
  citedby = {0},
  pages = {108-110},
  booktitle = {IEEE International Solid-State Circuits Conference, ISSCC 2024, San Francisco, CA, USA, February 18-22, 2024},
  publisher = {IEEE},
  isbn = {979-8-3503-0620-0},
}