MPA: Model-assisted PCB attestation via board-level RO and temperature compensation

Zimu Guo, Xiaolin Xu, Mark M. Tehranipoor, Domenic Forte. MPA: Model-assisted PCB attestation via board-level RO and temperature compensation. In 2017 Asian Hardware Oriented Security and Trust Symposium, AsianHOST 2017, Beijing, China, October 19-20, 2017. pages 25-30, IEEE Computer Society, 2017. [doi]

Abstract

Abstract is missing.