An Experimental Study on the Abrasive Machining Process of Electronic Substrate Material With A Novel Ultraviolet-Curable Resin Bond Diamond Lapping Plate

Lei Guo, Xinrong Zhang, Chul-Hee Lee, Ioan D. Marinescu, Yihe Zhang, Jizhuang Hui. An Experimental Study on the Abrasive Machining Process of Electronic Substrate Material With A Novel Ultraviolet-Curable Resin Bond Diamond Lapping Plate. IEEE Access, 7:64375-64385, 2019. [doi]

Abstract

Abstract is missing.