Comparison study on microstructure and mechanical properties of Sn-10Bi and Sn-Ag-Cu solder alloys and joints

Qinhan Guo, Zhenjiang Zhao, Chunlong Shen. Comparison study on microstructure and mechanical properties of Sn-10Bi and Sn-Ag-Cu solder alloys and joints. Microelectronics Reliability, 78:72-79, 2017. [doi]

Authors

Qinhan Guo

This author has not been identified. Look up 'Qinhan Guo' in Google

Zhenjiang Zhao

This author has not been identified. Look up 'Zhenjiang Zhao' in Google

Chunlong Shen

This author has not been identified. Look up 'Chunlong Shen' in Google