Comparison study on microstructure and mechanical properties of Sn-10Bi and Sn-Ag-Cu solder alloys and joints

Qinhan Guo, Zhenjiang Zhao, Chunlong Shen. Comparison study on microstructure and mechanical properties of Sn-10Bi and Sn-Ag-Cu solder alloys and joints. Microelectronics Reliability, 78:72-79, 2017. [doi]

Abstract

Abstract is missing.