Cohesive zone modeling for structural integrity analysis of IC interconnects

B. A. E. van Hal, R. H. J. Peerlings, M. G. D. Geers, Olaf van der Sluis. Cohesive zone modeling for structural integrity analysis of IC interconnects. Microelectronics Reliability, 47(8):1251-1261, 2007. [doi]

Abstract

Abstract is missing.