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TSV based 3D stacked ICs: Opportunities and challenges

Said Hamdioui. TSV based 3D stacked ICs: Opportunities and challenges. In Jaan Raik, Viera Stopjaková, Heinrich Theodor Vierhaus, Witold A. Pleskacz, Raimund Ubar, Helena Kruus, Maksim Jenihhin, editors, IEEE 15th International Symposium on Design and Diagnostics of Electronic Circuits & Systems, DDECS 2012, Tallinn, Estonia, April 18-20, 2012. pages 2, IEEE, 2012. [doi]

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Said Hamdioui

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