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Wireless power transfer using resonant inductive coupling for 3D integrated ICs

Sangwook Han, David D. Wentzloff. Wireless power transfer using resonant inductive coupling for 3D integrated ICs. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-5, IEEE, 2010. [doi]

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Sangwook Han

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David D. Wentzloff

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