Sangwook Han, David D. Wentzloff. Wireless power transfer using resonant inductive coupling for 3D integrated ICs. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-5, IEEE, 2010. [doi]
@inproceedings{HanW10-0, title = {Wireless power transfer using resonant inductive coupling for 3D integrated ICs}, author = {Sangwook Han and David D. Wentzloff}, year = {2010}, doi = {10.1109/3DIC.2010.5751455}, url = {http://dx.doi.org/10.1109/3DIC.2010.5751455}, researchr = {https://researchr.org/publication/HanW10-0}, cites = {0}, citedby = {0}, pages = {1-5}, booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010}, publisher = {IEEE}, }