J. Q. Han, Y. P. Wang, F. M. Guo, B. Xu, D. Y. Xiong, M.-C. Zhou, Y. C. Ye, Z. Q. Zhu, J. H. Chu. Electrical behavior on packaging module for the novel photoelectric sensor. In 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010, Xiamen, China, January 20-23, 2010. pages 233-236, IEEE, 2010. [doi]
Abstract is missing.