Haitao Han, Wen Yin, Wenqian Wang, Zegui Pang. Auto-assign method for large scale flip-chip package design. In 2011 IEEE 9th International Conference on ASIC, ASICON 2011, Xiamen, China, October 25-28, 2011. pages 929-932, IEEE, 2011. [doi]
@inproceedings{HanYWP11,
title = {Auto-assign method for large scale flip-chip package design},
author = {Haitao Han and Wen Yin and Wenqian Wang and Zegui Pang},
year = {2011},
doi = {10.1109/ASICON.2011.6157358},
url = {http://dx.doi.org/10.1109/ASICON.2011.6157358},
researchr = {https://researchr.org/publication/HanYWP11},
cites = {0},
citedby = {0},
pages = {929-932},
booktitle = {2011 IEEE 9th International Conference on ASIC, ASICON 2011, Xiamen, China, October 25-28, 2011},
publisher = {IEEE},
isbn = {978-1-61284-192-2},
}