Yongcun Hao, Weizheng Yuan, Jianbing Xie, Honglong Chang. A novel packaging stress isolation structure for SOI based MEMS gyroscopes. In 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016. pages 1-3, IEEE, 2016. [doi]
@inproceedings{HaoYXC16,
title = {A novel packaging stress isolation structure for SOI based MEMS gyroscopes},
author = {Yongcun Hao and Weizheng Yuan and Jianbing Xie and Honglong Chang},
year = {2016},
doi = {10.1109/ICSENS.2016.7808649},
url = {https://doi.org/10.1109/ICSENS.2016.7808649},
researchr = {https://researchr.org/publication/HaoYXC16},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016},
publisher = {IEEE},
isbn = {978-1-4799-8287-5},
}