A novel packaging stress isolation structure for SOI based MEMS gyroscopes

Yongcun Hao, Weizheng Yuan, Jianbing Xie, Honglong Chang. A novel packaging stress isolation structure for SOI based MEMS gyroscopes. In 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016. pages 1-3, IEEE, 2016. [doi]

References

No references recorded for this publication.

Cited by

No citations of this publication recorded.