Steven C. Hauser, Gregory J. Gerling. Imaging the 3-D deformation of the finger pad when interacting with compliant materials. In Katherine J. Kuchenbecker, Gregory J. Gerling, Yon Visell, editors, 2018 IEEE Haptics Symposium, HAPTICS 2018, San Francisco, CA, USA, March 25-28, 2018. pages 7-13, IEEE, 2018. [doi]
Abstract is missing.