Advanced Burn-In - An Optimized Product Stress and Test Flow for Automotive Microcontrollers

Chen He. Advanced Burn-In - An Optimized Product Stress and Test Flow for Automotive Microcontrollers. In IEEE International Test Conference, ITC 2019, Washington, DC, USA, November 9-15, 2019. pages 1-6, IEEE, 2019. [doi]

@inproceedings{He19-22,
  title = {Advanced Burn-In - An Optimized Product Stress and Test Flow for Automotive Microcontrollers},
  author = {Chen He},
  year = {2019},
  doi = {10.1109/ITC44170.2019.9000147},
  url = {https://doi.org/10.1109/ITC44170.2019.9000147},
  researchr = {https://researchr.org/publication/He19-22},
  cites = {0},
  citedby = {0},
  pages = {1-6},
  booktitle = {IEEE International Test Conference, ITC 2019, Washington, DC, USA, November 9-15, 2019},
  publisher = {IEEE},
  isbn = {978-1-7281-4823-6},
}