Hot spot analysis during thermal shutdown of SOI BCDMOS half bridge driver for automotive applications

Michael Heer, P. Grombach, A. Heid, Dionyz Pogany. Hot spot analysis during thermal shutdown of SOI BCDMOS half bridge driver for automotive applications. Microelectronics Reliability, 48(8-9):1525-1528, 2008. [doi]

Abstract

Abstract is missing.