From diffusive in-plane to ballistic out-of-plane heat transport in thin non-crystalline films

R. Heiderhoff, T. Haeger, K. Dawada, Thomas Riedl. From diffusive in-plane to ballistic out-of-plane heat transport in thin non-crystalline films. Microelectronics Reliability, 76:222-226, 2017. [doi]

Abstract

Abstract is missing.