Active-lite interposer for 2.5 & 3D integration

Geert Hellings, Mirko Scholz, Mikael Detalle, Dimitrios Velenis, Muriel de Potter de ten Broeck, C. Roda Neve, Y. Li, S. Van Huylenbroek, S. H. Chen, Erik Jan Marinissen, Antonio La Manna, Geert Van der Plas, Dimitri Linten, Eric Beyne, Aaron Thean. Active-lite interposer for 2.5 & 3D integration. In Symposium on VLSI Circuits, VLSIC 2015, Kyoto, Japan, June 17-19, 2015. pages 222, IEEE, 2015. [doi]

@inproceedings{HellingsSDVBNLH15,
  title = {Active-lite interposer for 2.5 & 3D integration},
  author = {Geert Hellings and Mirko Scholz and Mikael Detalle and Dimitrios Velenis and Muriel de Potter de ten Broeck and C. Roda Neve and Y. Li and S. Van Huylenbroek and S. H. Chen and Erik Jan Marinissen and Antonio La Manna and Geert Van der Plas and Dimitri Linten and Eric Beyne and Aaron Thean},
  year = {2015},
  doi = {10.1109/VLSIC.2015.7231374},
  url = {http://dx.doi.org/10.1109/VLSIC.2015.7231374},
  researchr = {https://researchr.org/publication/HellingsSDVBNLH15},
  cites = {0},
  citedby = {0},
  pages = {222},
  booktitle = {Symposium on VLSI Circuits, VLSIC 2015, Kyoto, Japan, June 17-19, 2015},
  publisher = {IEEE},
  isbn = {978-4-86348-502-0},
}