Wireless Dual Mode Haptic Thimble based on Magnetoactive Rubber

Yong Hea Heo, Gyubin An, Hyun-Jeong Kim, Sang-Youn Kim, Mohammad Shadman Hashem, Seokhee Jeon, Dong-Soo Choi. Wireless Dual Mode Haptic Thimble based on Magnetoactive Rubber. In IEEE World Haptics Conference, WHC 2023, Delft, Netherlands, July 10-13, 2023. pages 71-77, IEEE, 2023. [doi]

Authors

Yong Hea Heo

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Gyubin An

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Hyun-Jeong Kim

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Sang-Youn Kim

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Mohammad Shadman Hashem

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Seokhee Jeon

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Dong-Soo Choi

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