Wireless Dual Mode Haptic Thimble based on Magnetoactive Rubber

Yong Hea Heo, Gyubin An, Hyun-Jeong Kim, Sang-Youn Kim, Mohammad Shadman Hashem, Seokhee Jeon, Dong-Soo Choi. Wireless Dual Mode Haptic Thimble based on Magnetoactive Rubber. In IEEE World Haptics Conference, WHC 2023, Delft, Netherlands, July 10-13, 2023. pages 71-77, IEEE, 2023. [doi]

@inproceedings{HeoAKKHJC23,
  title = {Wireless Dual Mode Haptic Thimble based on Magnetoactive Rubber},
  author = {Yong Hea Heo and Gyubin An and Hyun-Jeong Kim and Sang-Youn Kim and Mohammad Shadman Hashem and Seokhee Jeon and Dong-Soo Choi},
  year = {2023},
  doi = {10.1109/WHC56415.2023.10224377},
  url = {https://doi.org/10.1109/WHC56415.2023.10224377},
  researchr = {https://researchr.org/publication/HeoAKKHJC23},
  cites = {0},
  citedby = {0},
  pages = {71-77},
  booktitle = {IEEE World Haptics Conference, WHC 2023, Delft, Netherlands, July 10-13, 2023},
  publisher = {IEEE},
  isbn = {979-8-3503-9993-6},
}