Freddie Hong, Connor Myant, David E. Boyle. Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending. In Yoshifumi Kitamura, Aaron Quigley, Katherine Isbister, Takeo Igarashi, Pernille Bjørn, Steven Mark Drucker, editors, CHI '21: CHI Conference on Human Factors in Computing Systems, Virtual Event / Yokohama, Japan, May 8-13, 2021. ACM, 2021. [doi]
@inproceedings{HongMB21,
title = {Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending},
author = {Freddie Hong and Connor Myant and David E. Boyle},
year = {2021},
doi = {10.1145/3411764.3445469},
url = {https://doi.org/10.1145/3411764.3445469},
researchr = {https://researchr.org/publication/HongMB21},
cites = {0},
citedby = {0},
booktitle = {CHI '21: CHI Conference on Human Factors in Computing Systems, Virtual Event / Yokohama, Japan, May 8-13, 2021},
editor = {Yoshifumi Kitamura and Aaron Quigley and Katherine Isbister and Takeo Igarashi and Pernille Bjørn and Steven Mark Drucker},
publisher = {ACM},
isbn = {978-1-4503-8096-6},
}