Freddie Hong, Connor Myant, David E. Boyle. Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending. In Yoshifumi Kitamura, Aaron Quigley, Katherine Isbister, Takeo Igarashi, Pernille Bjørn, Steven Mark Drucker, editors, CHI '21: CHI Conference on Human Factors in Computing Systems, Virtual Event / Yokohama, Japan, May 8-13, 2021. ACM, 2021. [doi]
Abstract is missing.