Using neural networks and immune algorithms to find the optimal parameters for an IC wire bonding process

Tung-Hsu (Tony) Hou, Chi-Hung Su, Hung-Zhi Chang. Using neural networks and immune algorithms to find the optimal parameters for an IC wire bonding process. Expert Syst. Appl., 34(1):427-436, 2008. [doi]

@article{HouSC08,
  title = {Using neural networks and immune algorithms to find the optimal parameters for an IC wire bonding process},
  author = {Tung-Hsu (Tony) Hou and Chi-Hung Su and Hung-Zhi Chang},
  year = {2008},
  doi = {10.1016/j.eswa.2006.09.024},
  url = {http://dx.doi.org/10.1016/j.eswa.2006.09.024},
  researchr = {https://researchr.org/publication/HouSC08},
  cites = {0},
  citedby = {0},
  journal = {Expert Syst. Appl.},
  volume = {34},
  number = {1},
  pages = {427-436},
}