Using neural networks and immune algorithms to find the optimal parameters for an IC wire bonding process

Tung-Hsu (Tony) Hou, Chi-Hung Su, Hung-Zhi Chang. Using neural networks and immune algorithms to find the optimal parameters for an IC wire bonding process. Expert Syst. Appl., 34(1):427-436, 2008. [doi]

References

No references recorded for this publication.

Cited by

No citations of this publication recorded.