I-Wen Hsieh, Yu-Chi Chen, Shao-Kang Hung. Design and Implementation of Bending Force Sensor Featuring Printed Circuit Board. In IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2023, Seattle, WA, USA, June 28-30, 2023. pages 579-583, IEEE, 2023. [doi]
@inproceedings{HsiehCH23-0, title = {Design and Implementation of Bending Force Sensor Featuring Printed Circuit Board}, author = {I-Wen Hsieh and Yu-Chi Chen and Shao-Kang Hung}, year = {2023}, doi = {10.1109/AIM46323.2023.10196200}, url = {https://doi.org/10.1109/AIM46323.2023.10196200}, researchr = {https://researchr.org/publication/HsiehCH23-0}, cites = {0}, citedby = {0}, pages = {579-583}, booktitle = {IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2023, Seattle, WA, USA, June 28-30, 2023}, publisher = {IEEE}, isbn = {978-1-6654-7633-1}, }