TSV Redundancy: Architecture and Design Issues in 3-D IC

Ang-Chih Hsieh, TingTing Hwang. TSV Redundancy: Architecture and Design Issues in 3-D IC. IEEE Trans. VLSI Syst., 20(4):711-722, 2012. [doi]

Authors

Ang-Chih Hsieh

This author has not been identified. Look up 'Ang-Chih Hsieh' in Google

TingTing Hwang

This author has not been identified. Look up 'TingTing Hwang' in Google