A multi-layered methodology for defect-tolerance of datapath modules in processors

Hsunwei Hsiung, Sandeep K. Gupta. A multi-layered methodology for defect-tolerance of datapath modules in processors. In 33rd IEEE VLSI Test Symposium, VTS 2015, Napa, CA, USA, April 27-29, 2015. pages 1-6, IEEE, 2015. [doi]

Authors

Hsunwei Hsiung

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Sandeep K. Gupta

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