Effects of copper CMP and post clean process on VRDB and TDDB at 28nm and advanced technology node

Li Chieh Hsu, Yu-Min Lin, Chien-Liang Wu, Wei Kun Lee, Yen-Chun Liu, Cheng Pu Chiu, Hsin Kuo Hsu, Chun-Yi Wang, Chien-Chung Huang, Chin Fu Lin. Effects of copper CMP and post clean process on VRDB and TDDB at 28nm and advanced technology node. In IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015. pages 3, IEEE, 2015. [doi]

Abstract

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