Quantitative reliability analysis of flip-chip packages under thermal-cyclic loading and in consideration of parameter uncertainties

Yao Hsu, Chih-Yen Su, Wen-Fang Wu. Quantitative reliability analysis of flip-chip packages under thermal-cyclic loading and in consideration of parameter uncertainties. Microelectronics Reliability, 51(12):2284-2289, 2011. [doi]

Abstract

Abstract is missing.