Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging

Xiaowu Hu, Yulong Li, Yong Liu, Yi Liu, Zhixian Min. Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging. Microelectronics Reliability, 54(8):1575-1582, 2014. [doi]

Authors

Xiaowu Hu

This author has not been identified. Look up 'Xiaowu Hu' in Google

Yulong Li

This author has not been identified. Look up 'Yulong Li' in Google

Yong Liu

This author has not been identified. Look up 'Yong Liu' in Google

Yi Liu

This author has not been identified. Look up 'Yi Liu' in Google

Zhixian Min

This author has not been identified. Look up 'Zhixian Min' in Google