Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging

Xiaowu Hu, Yulong Li, Yong Liu, Yi Liu, Zhixian Min. Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging. Microelectronics Reliability, 54(8):1575-1582, 2014. [doi]

Abstract

Abstract is missing.