3D stacking using Cu-Cu direct bonding

Y. H. Hu, C. S. Liu, M. J. Lii, K. J. Rebibis, Anne Jourdain, Antonio La Manna, Gerald Beyer, Eric Beyne, C. H. Yu. 3D stacking using Cu-Cu direct bonding. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]

Abstract

Abstract is missing.