Han-Wen Hu, Wei-Chen Wang, Chung Kuang Chen, Yung-Chun Lee, Bo-Rong Lin, Huai-Mu Wang, Yen-Po Lin, Yu-Chao Lin, Chih-Chang Hsieh, Chia-Ming Hu, Yi-Ting Lai, Han-Sung Chen, Yuan-Hao Chang 0001, Hsiang-Pang Li, Tei-Wei Kuo, Keh-Chung Wang, Meng-Fan Chang, Chun-Hsiung Hung, Chih-Yuan Lu. A 512Gb In-Memory-Computing 3D-NAND Flash Supporting Similar-Vector-Matching Operations on Edge-AI Devices. In IEEE International Solid-State Circuits Conference, ISSCC 2022, San Francisco, CA, USA, February 20-26, 2022. pages 138-140, IEEE, 2022. [doi]
@inproceedings{HuWCLLWLLHHLC0L22,
title = {A 512Gb In-Memory-Computing 3D-NAND Flash Supporting Similar-Vector-Matching Operations on Edge-AI Devices},
author = {Han-Wen Hu and Wei-Chen Wang and Chung Kuang Chen and Yung-Chun Lee and Bo-Rong Lin and Huai-Mu Wang and Yen-Po Lin and Yu-Chao Lin and Chih-Chang Hsieh and Chia-Ming Hu and Yi-Ting Lai and Han-Sung Chen and Yuan-Hao Chang 0001 and Hsiang-Pang Li and Tei-Wei Kuo and Keh-Chung Wang and Meng-Fan Chang and Chun-Hsiung Hung and Chih-Yuan Lu},
year = {2022},
doi = {10.1109/ISSCC42614.2022.9731775},
url = {https://doi.org/10.1109/ISSCC42614.2022.9731775},
researchr = {https://researchr.org/publication/HuWCLLWLLHHLC0L22},
cites = {0},
citedby = {0},
pages = {138-140},
booktitle = {IEEE International Solid-State Circuits Conference, ISSCC 2022, San Francisco, CA, USA, February 20-26, 2022},
publisher = {IEEE},
isbn = {978-1-6654-2800-2},
}