Yongfang Hu, Kun Yan, Ziyuan Wang, Liuwei Wang, Yipeng Sun, Yuefei Wang, Xinlong Zhang, Zongjie Han, Qingan Huang, Lei Han. Hermetic Interlayer Interconnection Technology Based on SAC305 Solder Paste. In Antonio J. Tallón-Ballesteros, Estefanía Cortés-Ancos, Diego A. López García, editors, Electronics, Communications and Networks - Proceedings of the 13th International Conference (CECNet 2023), Macao, China, 17-20 November 2023. Volume 381 of Frontiers in Artificial Intelligence and Applications, pages 542-548, IOS Press, 2023. [doi]
@inproceedings{HuYWWSWZHHH23,
title = {Hermetic Interlayer Interconnection Technology Based on SAC305 Solder Paste},
author = {Yongfang Hu and Kun Yan and Ziyuan Wang and Liuwei Wang and Yipeng Sun and Yuefei Wang and Xinlong Zhang and Zongjie Han and Qingan Huang and Lei Han},
year = {2023},
doi = {10.3233/FAIA231236},
url = {https://doi.org/10.3233/FAIA231236},
researchr = {https://researchr.org/publication/HuYWWSWZHHH23},
cites = {0},
citedby = {0},
pages = {542-548},
booktitle = {Electronics, Communications and Networks - Proceedings of the 13th International Conference (CECNet 2023), Macao, China, 17-20 November 2023},
editor = {Antonio J. Tallón-Ballesteros and Estefanía Cortés-Ancos and Diego A. López García},
volume = {381},
series = {Frontiers in Artificial Intelligence and Applications},
publisher = {IOS Press},
isbn = {978-1-64368-481-9},
}