Yongfang Hu, Kun Yan, Ziyuan Wang, Liuwei Wang, Yipeng Sun, Yuefei Wang, Xinlong Zhang, Zongjie Han, Qingan Huang, Lei Han. Hermetic Interlayer Interconnection Technology Based on SAC305 Solder Paste. In Antonio J. Tallón-Ballesteros, Estefanía Cortés-Ancos, Diego A. López García, editors, Electronics, Communications and Networks - Proceedings of the 13th International Conference (CECNet 2023), Macao, China, 17-20 November 2023. Volume 381 of Frontiers in Artificial Intelligence and Applications, pages 542-548, IOS Press, 2023. [doi]
Abstract is missing.