Chung-Ming Huang, Wei-Da Guo, Chia-Re Shen, Chih-Chung Tsai. Silicon-package-board co-design for the eye diagram prediction of a 3Gbps HDMI transmitter. In 2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013, Hsinchu, Taiwan, April 22-24, 2013. pages 1-3, IEEE, 2013. [doi]
@inproceedings{HuangGST13,
title = {Silicon-package-board co-design for the eye diagram prediction of a 3Gbps HDMI transmitter},
author = {Chung-Ming Huang and Wei-Da Guo and Chia-Re Shen and Chih-Chung Tsai},
year = {2013},
doi = {10.1109/VLDI-DAT.2013.6533856},
url = {http://dx.doi.org/10.1109/VLDI-DAT.2013.6533856},
researchr = {https://researchr.org/publication/HuangGST13},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013, Hsinchu, Taiwan, April 22-24, 2013},
publisher = {IEEE},
isbn = {978-1-4673-4435-7},
}