A study on the tensile fracture mechanism of 15 μm copper wire after EFO process

I.-Ting Huang, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen, Hao-Wen Hsueh. A study on the tensile fracture mechanism of 15 μm copper wire after EFO process. Microelectronics Reliability, 51(1):25-29, 2011. [doi]

Abstract

Abstract is missing.